Advanced Thermal Solutions superGRIP™ clipKIT™ Heat Sink Attachments promote a two-component system that quickly and securely mounts heat sinks to a range of hot running Ball Grid Array (BGA) components. These attachments are ideal for densely populated PCBs that have minimal space around components for mechanical attachment. ATS superGRIP heat sink attachments eliminate the need to drill holes, which allows the heat sink to be detached and reattached without damaging the component or PCB in the event the PCB needs to be reworked.
Features
Overall
Ideal for densely populated PCBsAvailable for straight fin, slant fin, cross-cut and pin fin heat sinksProvides tight, secure heat sink attachment in shock and vibration environmentsStrong, uniform attachment force helps achieve maximum performance from high-performance, phase-changing thermal interface materials (TIMs)Allows the heat sink to be detached and reattached without damaging the component or PCB in the event the PCB needs to be reworkedComes standard with clean break, reworkable, Chomerics T-766 phase change materialFrame and spring clips can be quickly installed or released using a flat-blade screwdriver or similar tool
